Exploring 3d Printed Electronics Towards Chip Packaging Applications
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In-Depth Information on 3d Printed Electronics Towards Chip Packaging Applications
Presentation by Rob Hendriks, Technical Lead, Holst Centre. For more information about IMAPS 2023 - Mike Newton, Sciperio - Virtual Presentation on TNO at Holst Centre is further exploring the possibilities of What we can do in technology is defined by our tools. If we want new possibilities, we need to create new tools. Greg Nordin was ...
Printed electronics
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